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Shenzhen Lizhifeng Electronic Equipment Co., Ltd

Address: Floor 4, Building 2, Hengchangrong Industrial Zone, No. 128, Shajing Shangnan East Road, Bao'an District, Shenzhen

Tel.: 13925215926

Marketing hot sale: 13925286095

Email: marktong@smtlf.cn

X-RAY

X-RAY View X2000

※ The BGA faulty soldering can be easily seen through the inspection with an inclination of 60 degrees
※ Bubble inspection can visually judge the bubble volume in the BGA welding ball and whether the welding spot is qualified

Scope of application
Applicable to BCC, BGA μ Welding effect inspection of BGA, CSP and other planar array devices.

Consulting

Product details

※ 倾斜60度检查,可轻易看清BGA虚焊不良
※ 汽泡检查,可直观判断BGA焊球内汽泡体积,直观判断该焊点是否合格

技术参数：
空间分辨率 5um
可搭载尺寸 SMX-1000 350mm*400mm
SMX-1000L 570mm*670mm
实际检查尺寸 SMX-1000 300mm*350mm
SMX-1000L 520mm*620mm
可搭载重量最大5kg
受光部倾斜最大60°
最高电压 90KV（10W）
图像检测装置平板检测器（FPD）
检查视野约2～35mm
放大倍率约6～158倍（动画最大为127倍）
输入电压 AC100V 1KVA
设备尺寸 SMX-1000 995mm*990mm*1285mm
SMX-1000L 1490mm*1525mm*1325mm
设备重量 SMX-1000 约500kg
SMX-1000L 约950kg
应用范围
适用于SMT生产过程中BCC、BGA、μBGA、CSP等面阵列器件的焊接效果检查。