中文版 Site Map

Welcome to browseShenzhen Lizhifeng Electronic Equipment Co., Ltd website!

Shenzhen Lizhifeng Electronic Equipment Co., Ltd

SMT overall solution equipment leader

+86 13925215926

+86 13925286095

Your location: Home > News > Industry News

News

Contact us

Shenzhen Lizhifeng Electronic Equipment Co., Ltd

Address: Floor 4, Building 2, Hengchangrong Industrial Zone, No. 128, Shajing Shangnan East Road, Bao'an District, Shenzhen

Tel.: 13925215926

Marketing hot sale: 13925286095

Email: marktong@smtlf.cn

Industry News

Sales lease SPI JET-6000
Update time:2020-08-27    Views:1430

Product features

1. Fast detection speed, which can really meet the requirements of 100% solder paste detection process.

2. The advanced three-dimensional calculation mode can accurately measure the height, area, volume, offset and short circuit of the printing solder paste.

3. Simple and fast positioning teaching mode and programming schedule.

4. Reliable data and chart analysis (SPC) can easily grasp the causes of undesirable phenomena.

5. Display the solder paste screen printing status in color gray scale, and timely feed back to support the adjustment of the solder paste printer.

6. Good reproducibility and reproducibility (GR&R<10%), contributing to the stability and improvement of the process.

7. It can accurately measure 8 mils of tiny CSP elements with good reproducibility.

System specifications

External dimensions 216 x 100 x 137 cm (78 x 39 x 54 in)

Product weight 1200 kg (2600 lbs)

Power supply AC 220~240 V, 50/60 Hz, 15 amps

Use air pressure 5~7 kgf/cm2 (70~100 psi)

Circuit board transmission speed (left → right or right → left) 300 mm/sec (12 in/sec)

Conveyor belt height (adjustable) 890~965mm (35~38 in)

Maximum detectable circuit board area 500 x 450 mm (15 x 16 in)

Minimum detectable board area 100 x 70 mm (4 x 2.75 in)

Circuit board thickness range 0.5~5.0 mm (0.02~0.2 in)

Top 2.5 mm (0.1 in) is reserved at the clamping end of the circuit board,

bottom 3.8 mm (0.2 in)

System performance

Detection speed 64 cm2/sec (9.94 in2/sec)

Circuit board locating point search time<4 seconds

X-Y axis pixel resolution 20 microns (0.788 mils)

Z-axis (height) resolution 1.225 microns (0.048 mils)

Maximum allowable plate bending<2mm for each scan width 42 mm

Detectable solder paste height range 50~450 micros (2~18 mils)

High reproducibility (3 sigma limit) CSP: 5 microns (8 to 18 mils in diameter)

BGA & QFP : 3 microns( ≧ 20 mils in diameter)

Volume reproducibility (3 sigma limit) CSP:&plusmn;  7 %( 8 to 18 mils in diameter)

BGA & QFP : &plusmn;  3 %( ≧ 20 mils in diameter)

High accuracy CSP: 8 microns (8 to 18 mils in diameter)

BGA & QFP : 5 microns( ≧ 20 mils in diameter)


 

Contact us

Shenzhen Lizhifeng Electronic Equipment Co., Ltd

Address: Floor 4, Building 2, Hengchangrong Industrial Zone, No. 128, Shajing Shangnan East Road, Bao'an District, Shenzhen

Tel.: 13925215926

Marketing hot sale: 13925286095

Email: marktong@smtlf.cn

Scan WeChat