The German AOI automatic optical detector TR7500SII is suitable for furnace front and furnace rear detection. This system is suitable for the detection resolution range of 10um to 15um. Using TRI's dynamic image taking technology, different from the walk stop type, dynamic image taking can reduce the possible vibration interference. The Deloitte AOI automatic optical detector TR7500SII has a multi area and highly elastic RGB W color light source system. With the low angle light source design, it can provide a better detection scheme for polarity and black components, Moreover, it can provide stable detection capability for micro components 01005 on lead-free and traditional assembly circuit boards.
Performance characteristics of Deloitte AOI automatic optical detector TR7500SII:
1. High speed detection dynamic detection technology can provide high-speed and clear actual image of circuit board.
2. The detection time of medium size circuit boards only takes 21 seconds (excluding the confirmation of fixed points and the time of entering and exiting the board).
3. The advanced color light source system has an elastic and multi angle light source setting mode, which can produce light from different angles and colors, providing more accurate and stable detection capability for solder joints of small components.
4. The graphical man-machine interface for light source control can greatly simplify the light source setting and programming time.
5. Simple programming environment: Only the CAD files of five data fields (component name, X-axis coordinate, Y-axis coordinate, rotation angle and package type) are needed to complete the programming
6. Program editing can also be easily completed for various specially configured multi board circuit boards
7. The part database function of the built-in graphical interface can directly select to apply the database, reducing the time for the detection frame creation and parameter setting.
8. Precise automatic bending compensation and multiple positioning point confirmation function can ensure the correctness and reproducibility of each detection result
9. The advanced optical resolution design (10, 15 and 20um) XGA 3CCD camera can capture 50 standard XGA format images (1024 x 768 pixels) per second. With superior image processing and computing technology, it can directly analyze the color on the circuit board and effectively detect defective products. Up to 10um/pixel optics
The resolution can effectively detect 01005 Chip/12mil Pitch IC. The staff can easily obtain the actual image and conduct artificial appearance re judgment and comparison.
10. Modular Control System of Built in Parts Database
11. The precision X-Y mechanical platform, PC board transmission system, image capture, light source control and computer host are all independently designed system modules, which can be maintained separately to provide convenience for the system.
Technical parameters of DELHI AOI automatic optical detector TR7500SII:
High speed color multi angle detection, capable of detecting 01005 elements
High defect coverage, using hybrid 2d 3d detection technology
Real 3d profile measurement technology, using double laser units
Intelligent rapid programming interface with automatic database and offline programming functions
Top view camera High sensitivity 4 mpix high-speed color camera
4 low angle cameras, high resolution color cameras • 3d laser sensors, high resolution and high measurement range
Optical resolution 10 μ m 15 μ m
Laser resolution 10 μ m (optional) 20 μ m 50 μ m 10 μ m (optional) 20 μ m 50 μ m
Image taking mode High speed dynamic image taking (with real 3d profile measurement)
Detection speed 2d 2d 3d 15 μ m 60 cm2/sec @ 10 μ m 40 - 60 cm2/sec
ten μ m 120 cm2/sec @ 15 μ M 27 - 39 cm2/sec depending on the size of the measurable plate
Component defects, missing parts, erection, side erection, pole reversal, rotation, displacement, wrong parts (ocv), damaged parts, reversed parts, warped parts, multiple parts
Tin spot defect: more tin, less tin, bridging, dip type components, tin eating, foot lifting, scratching/sticking on the surface of gold finger
Integrated yield management system 4.0 and yms lite before and after the furnace
System dimensions Circuit board dimensions 50 x 50 – 510 x 460 mm
Circuit board thickness 0.6 – 5 mm
Circuit board weight 3 kg
The conveying/fixing mode of the plate to be tested is that the system automatically enters and exits and clamps
Part height limit upper end 35mm, bottom end 40mm, side edge 3mm
Power demand 220V AC/10A, single phase
Machine weight 850 kg
Machine size (W) 1220mm x (D) 1480mm x (H) 1575mm
Shenzhen Lizhifeng Electronic Equipment Co., Ltd. specializes in the supply of SMT equipment: SMT mounter, reflow soldering, wave soldering, printing machine, AOI automatic optical detector, SPI solder paste thickness gauge, loading machine, unloading machine, connecting platform, parallel transfer machine, folding machine, plate suction machine, suction and delivery integrated loading machine, plate turnover machine, corner machine, multi-function buffer, screening machine, plate collector, etc., and provides one-stop wiring solutions for SMT production lines.